Price: €850.00 EUR

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NSG01/50

High Resolution NONCONTACT "GOLDEN" Silicon Cantilevers NSG01 series

• Standard chip size: 1.6x3.6x0.4 mm.
• High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
• Typical curvature radius of a tip: 10 nm.
• Tip height: 10 - 15 µm.
• Each chip has one RECTANGULAR spring.
• Recommended for noncontact/semicontact modes.
• Can be supplied with conductive TiN, W₂C, Pt, Au coatings.
• Calibrated SEM photo for each cantilever tip with guaranteed curvature radius 10nm or less.
• Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

Specification for probes of NSG01 series

Chip thickness 0.4mm Reflective side Au Spring number 1 Aspect ratio 3:1 Cone angle j <=22° Curvature radius of a tip typical 10nm

Cantilever series

Spring

Cantilever lenght, L±5µm

Cantilever width, W±3µm

Cantilever thickness, µm

Resonant frequency, kHz

Force constant, N/m

min

typical

max

min

typical

max

min

typical

max

NSG01 NSG01S

A

130

35

1.7

2.0

2.3

115

150

190

2.5

5.5

10

Highlights

• Calibrated SEM photo for each cantilever tip and guaranteed curvature radius 10nm or less at customer's requirement ( cantilever series with letter "S" in the series name).
• Compatible with the most commercial SPM devices.
• Chemically stable Au coating.
• Silicon is doped by boron with the concentration about 5x10²⁰ cm^-3 to avoid electrostatic charges.

Cantilever series

Recommended measuring mode N - noncontact, semicontact C - contact	cantilever series	S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less.