Price: €450.00 EUR

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DCP20/15

Coating Specification:

• Thickness of diamond coating is about 70nm.
• Diamond coating is doped with nitrogen.
• Film resistivity: 0,5-1 Ohm*cm
• Tip curvature radius after coating is 50-70nm.
• Recommended for electrical modes
• Specially recommended for Oxidation Nanolithography*.

* We made a special "survival" test - almost 50  LAO Lithography images of Mona Lisa were obtained by using only one tip. It was not destroyed even after such a hard work. After 50 attempts it was still "alive".

LAO Nanolithography was made on Ti film in Semicontact mode by NSG20 probe with conductive diamond coating.   NTEGRA Aura system. Scan size: 8x8µm.

The thickness of lithography line was measured after the "survival" test.
It is about 22nm.

I/U characteristic made by DCP20 tip on freshly cleaved HOPG
(Highly Oriented Pyrolitic Graphite):

Probe specification

• Standard chip size: 1.6x3.6x0.4 mm.
• High cemically stable reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
• Typical curvature radius of a tip: 10 nm.
• Tip height: 10 - 15 µm.
• Each chip has one TRIANGULAR spring.
• Compatible with the most commercial SPM devices.
• Silicon is doped by boron with the concentration about 5x10²⁰ cm^-3 to avoid electrostatic charges.
• Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

Specification for DCP20 series

Chip thickness 0.4mm Reflective side Au Spring number 1 Aspect ratio 3:1 Cone angle j <=22° Curvature radius of a tip typical 10nm

Available Cantilever series	Cantilever lenght, L±5µm	Cantilever width, W±3µm	Cantilever thickness, µm			Resonant frequency, kHz			Force constant, N/m
			min	typical	max	min	typical	max	min	typical	max
DCP20	90	60	1.7	2.0	2.3	260	420	630	28	48	91